VNII Signal
VNII Signal R&D is applied to manufacture this item
VNII Signal R&D is applied to manufacture this item
VNII Signal R&D is applied to manufacture this item
VNII Signal R&D is applied to manufacture this item
VNII Signal R&D is applied to manufacture this item
VNII Signal R&D is applied to manufacture this item
VNII Signal R&D is applied to manufacture this item
VNII Signal R&D is applied to manufacture this item
VNII Signal R&D is applied to manufacture this item
VNII Signal R&D is applied to manufacture this item
VNII Signal R&D is applied to manufacture this item
VNII Signal R&D is applied to manufacture this item
VNII Signal R&D is applied to manufacture this item
VNII Signal R&D is applied to manufacture this item
VNII Signal R&D is applied to manufacture this item

X-ray Inspection

X-ray inspection of soldered joints of printed circuit assemblies is available. It is performed with state-of-the-art equipment using fully digital image-processing system and computerized numerical system.

Inspected Items:

  • Any electronic component parts, including BGA, QFN, through-hole mounted components; printed circuit boards; printed circuit assemblies.

Detected Defects:

  • PCB defects: shift of layers, nonuniformity and breaks of hole metallization, cracks and discontinuity of tracks, short circuit of tracks;
  • Defects of component parts: shell cracks, wire damage, wire absence, cavities in solder/glue of the chip, wire deflection;
  • Defects of soldered joints: cavities, bridges, cracks, solder balls, absence of wetting, shift, insufficient quantity of solder, mounting holes filled with solder.

Main Specifications:

  • Max. voltage of X-ray tube: 180 kV
  • Max. power of X-ray tube: 20 W
  • Focal spot: 0.5 μm
  • Max. dimensions of test part: 680х635 mm
  • Max. weight of test part: 5 kg
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